08
Sep
New Delhi [India], September 8: ASML, the Dutch powerhouse in lithography, just pulled off a big win for the semiconductor world. It got firm commitments from the three biggest chipmakers—TSMC, Samsung, and Intel—to use its next-generation High-NA EUV technology. They announced the deal together right before the SPIE Bacus Conference in Monterey, California. Basically, all three are on board to move from the old 6-inch photomask standard to a much bigger 12-inch one. There’s a pilot line set for 2031, with full production lined up for 2033. This isn’t just a minor upgrade. It’s a major turning point for chipmaking,…
